Professor Ouyang Fan-Yi’s research is primarily dedicated to the development of nanostructured thin-film materials. Based on atomic diffusion theory, her work investigates the relationships between microstructure and properties of thin-film materials, with applications in the semiconductor and energy-related industries. Her research focuses on the process development of nanotwinned thin-film materials and further advances low-temperature chip-to-chip and wafer-to-wafer bonding technologies for advanced applications such as third-generation semiconductors, power devices, and heterogeneous chip integration. In addition, to address reliability issues arising from the continued miniaturization of interconnects in advanced packaging, her research team, within the framework of nonequilibrium thermodynamics, conducts in-depth studies on atomic diffusion behaviors induced by current stressing and temperature gradients, as well as their effects on material structural stability. Based on these investigations, the team aims to establish universal physical models with strong predictive capabilities.

Current research efforts emphasize the development of low-temperature, low-pressure metal chip bonding technologies operable in atmospheric environments, as well as hybrid bonding wafer-level integration technologies, to meet the demands of emerging vertical integration architectures and to support rapidly growing applications such as the Internet of Things (IoT) and high-power electronic devices.